Intel Core i9-10900KF 10C/20T 3.7 GHz 125W LGA1200 processor (BX8070110900KF)
$722.99
Intel Core i9-10900 (Comet Lake) Desktop Processor 10 Cores/ 20 Threads 3.7 GHz (Turbo 5.3 GHz) LGA 1200 (Intel 400 Series chipset) 65W. No build in graphics. (BX8070110900KF)
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Description
Intel® Optane™ Memory Supported
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT)
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® 64
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Identity Protection Technology
Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.
Additional information
Weight | 0.02722 kg |
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Processor family | 10th gen Intel® Core™ i9 |
Intel® Secure Key | Y |
Scalability | 1S |
CPU configuration (max) | 1 |
Embedded options available | N |
Thermal solution specification | PCG 2015D |
PCI Express CEM revision | 3.0 |
Harmonized System (HS) code | 8542310001 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
Intel® Identity Protection Technology (Intel® IPT) | Y |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel Trusted Execution Technology | N |
Intel® Thermal Velocity Boost | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel Stable Image Platform Program (SIPP) | N |
PCI Express configurations | 1×16,2×8,1×8+2×4 |
Intel® vPro™ Platform Eligibility | N |
Maximum memory | 128 GB |
Status | Launched |
Launch date | Q2'20 |
Processor package size | 37.5 x 37.5 mm |
Product type | Processor |
Tjunction | 100 °C |
Intel® Boot Guard | Y |
Intel® OS Guard | Y |
Intel® Optane™ Memory Ready | Y |
Intel Turbo Boost Max Technology 3.0 | Y |
Intel Virtualization Technology for Directed I/O (VT-d) | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel 64 | Y |
Intel Software Guard Extensions (Intel SGX) | Y |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
PCI Express slots version | 3.0 |
Processor frequency | 3.7 GHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Processor cores | 10 |
Processor socket | LGA 1200 (Socket H5) |
Component for | PC |
Processor lithography | 14 nm |
Box | Y |
Processor manufacturer | Intel |
Processor model | I9-10900KF |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor cache | 20 MB |
Processor cache type | Smart Cache |
Processor boost frequency | 5.3 GHz |
Processor codename | Comet Lake |
Processor ARK ID | 199331 |
Maximum number of PCI Express lanes | 16 |
Discrete graphics adapter model | Not available |
Thermal Monitoring Technologies | Y |
Idle States | Y |
Execute Disable Bit | Y |
Configurable TDP-down frequency | 3300 MHz |
Configurable TDP-down | 95 W |
Thermal Design Power (TDP) | 125 W |
On-board graphics adapter model | Not available |
Memory channels | Dual-channel |
Discrete graphics adapter | N |
On-board graphics adapter | N |
ECC | N |
Memory clock speeds supported by processor | 2933 MHz |
Memory types supported by processor | DDR4-SDRAM |
Maximum internal memory supported by processor | 128 GB |
Bus speed | 8 GT/s |
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